Copper-Molybdenum-Copper Alloy, referred to as Cu/Mo/Cu alloy, Cu-Mo-Cu alloy, CuMoCu alloy or CMC alloy, is a sandwich-structured composite material consisting of two metal elements, copper and molybdenum. It offers adjustable CTE, high thermal conductivity, and strength, and can be stamped into various components.
Structural Features:
1. CMC alloy has a three-layer structure, namely the layered arrangement of copper-molybdenum-copper.
2. The core material is molybdenum, and the two sides are covered with pure copper or dispersion-strengthened copper. This structure combines the advantages of high thermal conductivity of copper and low thermal expansion coefficient of molybdenum.
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Product Properties:
1. Thermal conductivity: Compared with materials such as molybdenum-copper alloy and tungsten-copper alloy, CMC alloy has a lower thermal expansion coefficient and higher thermal conductivity, which helps to cool various high-power components such as IGBT modules.
2. Density: CMC alloy has extremely high density and is the preferred packaging material for high-power electronic components at home and abroad.
3. Thermal expansion coefficient: By adjusting the thickness ratio of molybdenum and copper, CMC alloy can achieve a thermal expansion coefficient that matches that of ceramic materials and semiconductor materials.
4. High practicality and machinability: Molybdenum has high hardness and very brittle properties. Copper on the other hand, is much more malleable. The combination of the two causes the flexibility of the alloy to increase greatly, making it useful for machining or other parts that are subject to heavy use and/or wear.
Principal Uses:
1. Electronic packaging: As electronic packaging materials such as heat sinks and lead frames, it is used for packaging high-power electronic components.
2. Electric vehicles: It is used in IGBT modules (EV/HEV) of electric vehicle engines.
3. RF, microwave and semiconductor high-power devices: It is used to manufacture high-performance RF, microwave and semiconductor high-power devices.
4. Thermal control plates and heat sinks in military and civilian thermal control devices.
If you have any interest in our CMC alloy(copper molybdenum copper alloy) or other molybdenum alloy products, please feel free to contact us by email: sales@chinatungsten.com,sales@xiamentungsten.com or by telephone:86 592 512 9696.